《bumping》怎以读
英 ['bʌmpɪŋ]
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美 ['bʌmpɪŋ]
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《bumping》是什么意思
爆沸；突沸；放气；崩沸
撞倒，冲撞( bump的现在分词 )；颠簸着前进；
英英释义
bump[ 'bʌmpiŋ ]
- n.
- a lump on the body caused by a blow
- something that bulges out or is protuberant or projects from its surroundings
同义词：bulgehumpgibbositygibbousnessjutprominenceprotuberanceprotrusionextrusionexcrescence
- an impact (as from a collision)
"the bump threw him off the bicycle"
同义词：blow
- v.
- knock against with force or violence
"My car bumped into the tree"
同义词：knock
- come upon, as if by accident; meet with
同义词：findhappenchanceencounter
- dance erotically or dance with the pelvis thrust forward
"bump and grind"
- assign to a lower position; reduce in rank
同义词：demoterelegatebreakkick downstairs
- remove or force from a position of dwelling previously occupied
同义词：dislodgedisplace
- knock against with force or violence
学习《bumping》怎么用
词组短语
bump into无意中遇到、碰到
with a bump意外地，突然
bump against撞；碰
bump up突然增加；提升
bump off干掉]
bump mapping凹凸贴图；凸凹处理；凹凸映射
更多收起词组短语
双语例句
用作名词(n.)
- She saw a moth bumping against the window.
她看到一只飞蛾撞击着窗户。 - This article argues about application of judicature to taxi-drivers' bumping into bandits.
摘要本文对的士司机撞击抢劫犯司法适用的相关问题加以论述。
权威例句
Low-cost wafer bumping
Bumping Up Against the Barrier with the Binomial Method
Model Search by Bootstrap "Bumping"
Balancing Between Bagging and Bumping
Wafer level lead free solder bumping process & characterization
Waferlevel method for direct bumping on copper pads in integrated circuits
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
Information Encountering: It's More Than Just Bumping into Information
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
Bumping Up Against the Barrier with the Binomial Method
Model Search by Bootstrap "Bumping"
Balancing Between Bagging and Bumping
Wafer level lead free solder bumping process & characterization
Waferlevel method for direct bumping on copper pads in integrated circuits
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
Information Encountering: It's More Than Just Bumping into Information
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)