《bumps》怎以读
[bʌmps]
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《bumps》是什么意思
碰撞( bump的名词复数 );肿块;轻微撞车事故;隆起物
撞倒,冲撞( bump的第三人称单数 );颠簸着前进;
双语释义
v.(动词)
- vt. & vi. 撞倒; 冲撞 come against with a blow or knock
- vi. 颠簸着前进 move along in an uneven way, like a wheeled vehicle going over bumps
- [C]砰的一声;撞击 (the sound of) a sudden forceful blow,like sth heavy hitting a hard surface
- [C]肿块 swelling on the body
- [C]隆起物 uneven patch on a surface
英英释义
bump
- n.
- a lump on the body caused by a blow
- something that bulges out or is protuberant or projects from its surroundings
同义词:bulgehumpgibbositygibbousnessjutprominenceprotuberanceprotrusionextrusionexcrescence
- an impact (as from a collision)
"the bump threw him off the bicycle"
同义词:blow
- v.
- knock against with force or violence
"My car bumped into the tree"
同义词:knock
- come upon, as if by accident; meet with
同义词:findhappenchanceencounter
- dance erotically or dance with the pelvis thrust forward
"bump and grind"
- assign to a lower position; reduce in rank
同义词:demoterelegatebreakkick downstairs
- remove or force from a position of dwelling previously occupied
同义词:dislodgedisplace
- knock against with force or violence
学习《bumps》怎么用
词汇搭配
用作动词 (v.)
~+名词- bump the kerb撞到路边石
- bump the tree撞到树上
- bump along颠簸而行
- bump down颠簸而行
- bump off谋杀
- bump together撞在一起
- bump against撞着…
- bump into撞着…;偶然碰见
用作名词 (n.)
动词+~- avoid bump避开隆起之处
- bump between the two cars两车相撞
- bump of locality记不牢地点
词组短语
bump into无意中遇到、碰到
with a bump意外地,突然
bump against撞;碰
bump up突然增加;提升
bump off干掉]
bump mapping凹凸贴图;凸凹处理;凹凸映射
更多收起词组短语
双语例句
用作动词(v.)
- I've bumped my knee on the wall.
我的膝盖撞上了墙壁。 - I am so sorry to bump into you.
对不起,我撞到你了。 - The old bus bumped along the mountain road.
旧公共汽车沿著山路颠簸行驶。 - We bumped up and down along the gravel path.
我们沿砾石小路颠簸而行。 - We expect interest rates to be bumped up another quarter point.
我们期望利率再提高0.
用作名词(n.)
- She got a bump on her head.
她头上撞起了一个包。 - He fell down with a bump.
他噗通一声倒了下去。
权威例句
Waves, bumps, and patterns in neural field theories
Bars, bumps, and holes: Models for the generation of complex beach topography
Integrated circuit including conductive bumps
Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing
Machine Replacement and the Business Cycle: Lumps and Bumps
Coombes, S.: Waves, bumps, and patterns in neural field theories. Biol. Cybern. 93(2), 91-108
Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
85. Digital acuity measured by “the bumps” device correlates with degeneration of digital mechanoreceptors in peripheral neuropath...
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps
Bars, bumps, and holes: Models for the generation of complex beach topography
Integrated circuit including conductive bumps
Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing
Machine Replacement and the Business Cycle: Lumps and Bumps
Coombes, S.: Waves, bumps, and patterns in neural field theories. Biol. Cybern. 93(2), 91-108
Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
85. Digital acuity measured by “the bumps” device correlates with degeneration of digital mechanoreceptors in peripheral neuropath...
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps